发明名称 THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a technology capable of increasing a temperature gradient in a semiconductor layer in a thermoelectric conversion module.SOLUTION: A thermoelectric conversion module having at least one of a heating surface and a cooling surface, comprises: a plurality of semiconductor layers having same polarity; an insulation layer arranged between a plurality of semiconductor layers; and a conductive part provided inside of the insulation layer and electrically connecting a side closer to the heating surface of the semiconductor layer arranged on one side of the insulation layer to a side closer to the cooling surface of the semiconductor layer arranged on the other side of the insulation layer. At least one of the heating surface and the cooling surface includes an insulation protective part. The protective part has a heat transmission protective part positioned in the vicinity of an edge of the semiconductor layer, and a heat insulation protective part positioned in the vicinity of the edge of the semiconductor layer. The heat thermal conductivity of the heat transmission protective part is larger than that of the heat insulation protective part.</p>
申请公布号 JP2015005596(A) 申请公布日期 2015.01.08
申请号 JP20130129446 申请日期 2013.06.20
申请人 NGK SPARK PLUG CO LTD 发明人 TAKAKURA MASAHIRO;OMORI TSUNETSUGU
分类号 H01L35/32;C01G51/00;H01L35/22;H01L35/30;H01L37/00 主分类号 H01L35/32
代理机构 代理人
主权项
地址