System and Method for a High Retention Module Interface

摘要

A device includes a substrate, a first antenna connection, and a first retention mechanism. The substrate has atop surface and a bottom surface. The first antenna connection is mounted directly to the top surface of the substrate, and is configured to connect with a first antenna. The first retention mechanism is connected at a first location of the bottom surface of the substrate to provide support for the substrate at the first antenna connection when the first antenna connection is connected to the first antenna. The first location of the first retention mechanism is selected to be directly below the first antenna connection.

主权项

1. A device comprising:
a substrate having a top surface and a bottom surface; a plurality of solder tabs connected to the bottom surface of the substrate, wherein the solder tabs are configured to provide support to the substrate; a first antenna connection mounted directly to the top surface of the substrate, wherein the first antenna connection is configured to connect with a first antenna; and a first retention mechanism connected at a first location of the bottom surface of the substrate to provide support for the substrate at the first antenna connection when the first antenna connection is connected to the first antenna, wherein the first location of the first retention mechanism is directly below the first antenna connection.