| 发明名称 |
COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAID COATED BOND WIRES |
| 摘要 |
<p>The present invention relates to a bond wire having a metal core (202), a dielectric layer (200, 204), and a ground connectable metallization (206), wherein the bond wire has one or more vapor barrier coatings. Further, the present invention relates to a die package with at least one bond wire according to the invention.</p> |
| 申请公布号 |
CA2915404(A1) |
申请公布日期 |
2015.01.08 |
| 申请号 |
CA20142915404 |
申请日期 |
2014.07.02 |
| 申请人 |
ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG |
发明人 |
CAHILL, SEAN S.;SANJUAN, ERIC A. |
| 分类号 |
H01L23/49;H01L23/00;H01L23/31;H01L23/50;H01L23/66 |
主分类号 |
H01L23/49 |
| 代理机构 |
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