METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, SENSOR MODULE, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device having high reliability.SOLUTION: A method of manufacturing a semiconductor device 1 comprises the steps of: preparing a semiconductor element 10 having a first surface 10a and electrodes 12 located on the first surface 10a; forming a first resin layer 20 on the first surface 10a including the electrodes 12; forming a first metal layer 31 electrically connected to the electrodes 12 on a third surface 23 of the first resin layer 20 opposite to a second surface 22 facing the semiconductor layer 10; forming a second resin layer 41 covering a sixth surface 35 connecting a fourth surface 33 of the first metal layer 31 facing the first resin layer 20 and a fifth surface 34 opposite to the fourth surface 33 and the fifth surface 34 of the first metal layer 31; providing openings 42 exposing the fifth surface 34 of the first metal layer 31 on the second resin layer 41; and forming second metal layers 51 in the openings 42 by electroless plating with the second resin layer 41 covering the sixth surface 35 of the first metal layer 31.