| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste and a conductive film which have a low volume resistivity even in a low-temperature firing process and are excellent in heat resistance and adhesiveness.SOLUTION: A conductive paste and a conductive film use at least a phenolic hydroxy group-containing aromatic polyamide resin as a binder resin. The phenolic hydroxy group-containing aromatic polyamide resin represented by following formula (1), (where m and n represent average values and satisfy 0<n/(m+n)≤1, and m+n is a positive number of 2-200; Arrepresents a divalent aromatic group; Arrepresents a divalent aromatic group having a phenolic hydroxyl group; and Arrepresents a divalent aromatic group). |
