发明名称 |
Frame level partial cooling boost for drawer and/or node level processors |
摘要 |
A hybrid cooling system is provided which is particularly useful for cooling electronic circuit components disposed on circuit boards arranged in a plurality of drawers within a cabinet or frame. Air cooling is provided locally with a supplementary, auxiliary, or secondary cooling system being provided at more distant frame level locations. This configuration permits optimal sizing of the respective hybrid cooling system components without negatively impacting the coefficient of performance (COP). Hybrid heat sinks are employed to accommodate the hybrid cooling system design.
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申请公布号 |
US6970355(B2) |
申请公布日期 |
2005.11.29 |
申请号 |
US20020300615 |
申请日期 |
2002.11.20 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ELLSWORTH, JR. MICHAEL J.;LEHMAN BRET W.;MATTESON JASON A.;SCHMIDT ROGER R. |
分类号 |
H01L23/467;H05K7/20;(IPC1-7):H05H7/20 |
主分类号 |
H01L23/467 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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