发明名称 |
COMPONENT MOUNTING METHOD AND MOUNTING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method and a mounting apparatus of a component capable of mounting components with a precise inter-member gap free from influences of thermal expansion of the mounting apparatus in a process in which the temperature of the mounting apparatus varies or in a long period operation.SOLUTION: During mounting operation, a distance B to a mount member 11 and a distance A to the upper face 14 of a substrate 12 are simultaneously measured to calculate an inter-member gap D. The components are mounted while controlling the distances to be a preset value respectively. |
申请公布号 |
JP2015005726(A) |
申请公布日期 |
2015.01.08 |
申请号 |
JP20140082137 |
申请日期 |
2014.04.11 |
申请人 |
PANASONIC IP MANAGEMENT CORP |
发明人 |
MIYAKE TAKAHIRO;EBIHARA YUTAKA;OSUMI TAKATOSHI;SAKURAI DAISUKE |
分类号 |
H05K13/04 |
主分类号 |
H05K13/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|