发明名称 COMPONENT MOUNTING METHOD AND MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a mounting method and a mounting apparatus of a component capable of mounting components with a precise inter-member gap free from influences of thermal expansion of the mounting apparatus in a process in which the temperature of the mounting apparatus varies or in a long period operation.SOLUTION: During mounting operation, a distance B to a mount member 11 and a distance A to the upper face 14 of a substrate 12 are simultaneously measured to calculate an inter-member gap D. The components are mounted while controlling the distances to be a preset value respectively.
申请公布号 JP2015005726(A) 申请公布日期 2015.01.08
申请号 JP20140082137 申请日期 2014.04.11
申请人 PANASONIC IP MANAGEMENT CORP 发明人 MIYAKE TAKAHIRO;EBIHARA YUTAKA;OSUMI TAKATOSHI;SAKURAI DAISUKE
分类号 H05K13/04 主分类号 H05K13/04
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