IC CARD, LAMINATED SHEET, AND IC CARD PRODUCTION METHOD

摘要

Provided are an IC card capable of improving quality of appearance and reducing damage to IC chips during production; a laminated sheet; and an IC card production method.　The card (1) comprises a module substrate (40) having an IC chip (41) mounted thereon; a porous layer (30) having a larger outer shape than the module substrate (40) and being directly laminated to the upper side (Z2) of the module substrate (40), said upper side (Z2) being the IC chip (41) mounting surface; and a base material layer (50) having a larger outer shape than the module substrate (40) and being directly laminated to the lower side (Z1) of the module substrate (40). The porous layer (30) and the base material layer (50) are thermally bonded in an outer perimeter range (A1) of the module substrate (40), the outer perimeter range (A1) having a larger outer shape than the module substrate (40).