| 摘要 |
<p>PURPOSE: A printed circuit board and a manufacturing method thereof are provided to increase the degree of freedom of circuit pattern configuration by supplying a manufacturing method which can serially connect wires between layers. CONSTITUTION: Conductive rods(121,122), first circuit patterns(131,132) connected to the conductive load are formed on one side of a base. An insulator(140) is formed on one side of the base. Second circuit patterns(151,152) connected to the conductive load are formed on one side of the insulator. In the insulator, the base is removed. The first and the second circuit pattern are formed by lithography. The second circuit pattern is embedded in the insulator. The conductive load and the second circuit pattern are connected to the connecting members(161,162) of the conductive material.</p> |
