MOLDED RESIN BODY FOR SURFACE-MOUNTED LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND SURFACE-MOUNTED LIGHT-EMITTING DEVICE

摘要

A molded resin body for surface-mounted light-emitting device has cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 μm to 10 μm, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMS) under the conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.

主权项

1. A molded resin body for surface-mounted light-emitting device, comprising:
a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at a bottom portion, wherein a ten-point average roughness (Rz) of an opening surface of the concave portion is 1 μm or more and 10 μm or less, a glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and an optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and an optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.