发明名称 Compensated Photonic Device Structure And Fabrication Method Thereof
摘要 Various embodiments of a compensated photonic device structure and fabrication method thereof are described herein. In one aspect, a photonic device may include a substrate and a functional layer disposed on the substrate. The substrate may be made of a first material and the functional layer may be made of a second material that is different from the first material. The photonic device may also include a compensation region formed at an interface region between the substrate and the functional layer. The compensation region may be doped with compensation dopants such that a first carrier concentration around the interface region of function layer is reduced and a second carrier concentration in a bulk region of functional layer is reduced.
申请公布号 US2015008433(A1) 申请公布日期 2015.01.08
申请号 US201414326250 申请日期 2014.07.08
申请人 SiFotonics Technologies Co., Ltd. 发明人 Huang Mengyuan;Wang Liangbo;Li Su;Shi Tuo;Cai Pengfei;Chen Wang;Hong Ching-yin;Pan Dong
分类号 H01L31/109;H01L31/0376 主分类号 H01L31/109
代理机构 代理人
主权项 1. A photonic device, comprising: a silicon-based substrate; a first contact layer heavily doped with first-type dopants and disposed on the substrate; a multiplication layer disposed on the first contact layer; a charge layer doped with second-type dopants and disposed on the multiplication layer; a germanium (Ge) absorption layer disposed on the charge layer; a second contact layer heavily doped with the second-type dopants and disposed on the Ge absorption layer; one or more anti-reflection layers disposed on the second contact layer; and a compensation region formed at an interface region between the charge layer and the Ge absorption layer, the compensation region doped with compensation dopants such that a first carrier concentration around the interface region of the Ge absorption layer is reduced and a second carrier concentration in a bulk region of the Ge absorption layer is reduced.
地址 Woburn MA US