| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a photoresist more excellent in sensitivity to light than a conventional photosensitive resin composition, and capable of forming a high resolution pattern by direct laser exposure without a mask, and to provide a method for preparing the same and a dry film resist comprising the same. <P>SOLUTION: The photosensitive resin composition comprises (a) an alkali-soluble acrylate resin, (b) a cross-linking monomer having at least two ethylenic double bonds, and (c) a phosphine oxide type photopolymerization initiator and an acridone type photopolymerization initiator. The method for preparing the same and the dry film resist comprising the same are also provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
