发明名称 PLASMA TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus capable of easily coping with various requirement processing widths of an object to be processed. <P>SOLUTION: A first plasma production unit 10A wherein three or more electrodes 11, 12 extended in one direction are arranged in a direction perpendicular to the one direction and a discharge slit 14 is formed between adjacent electrodes and a second plasma production unit 10B having the same configuration as it are lined in a row and arranged diagonally to a movement direction of the object 90 to be processed. A relative locus of the discharge slit 14A at an end of the first plasma production unit 10A on the side of the second plasma production unit to the object to be processed and a relative locus of the discharge slit 14B at an end of the second plasma production unit 10B on the side of the first plasma production unit to the object to be processed are made continuous to each other. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006228659(A) 申请公布日期 2006.08.31
申请号 JP20050043638 申请日期 2005.02.21
申请人 SEKISUI CHEM CO LTD 发明人 TAKEUCHI HIROTO
分类号 H05H1/24;B08B7/00;H01L21/3065 主分类号 H05H1/24
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