| 摘要 |
<p>In a high frequency module, mounting lands for reception signal output side ports of SAW duplexers, respectively, on a top surface of a multilayer body are arranged so as to be superposed on reception side external connection lands on a bottom surface of the multilayer body along the layer direction and the mounting lands are directly connected to the reception side external connection lands via holes. Transmission side external connection lands are located on the bottom surface of the multilayer body. The transmission side external connection lands are connected to mounting lands for transmission signal input side ports on the top surface of the multilayer body via certain inner layer electrodes that do not come close to the via holes of the reception system and the via holes.</p> |
