| 摘要 |
<p>In a metal base substrate with a low-temperature sintering ceramic layer provided on a metal substrate, while making it possible to make the metal substrate from copper, the low-temperature sintering ceramic layer is less likely to crack or peel at the interface with the metal substrate, and the anti-peeling strength of a surface conductor is improved. In the metal base substrate, the thermal expansion coefficient of the metal substrate is greater than the thermal expansion coefficient of the low-temperature sintering ceramic layer, the average difference in thermal expansion coefficients of the metal substrate and the low-temperature sintering ceramic layer at approximately 25° C. to 400° C. is about 4 ppm/° C. to about 9 ppm/° C., and the low-temperature sintering ceramic layer has a Young's modulus less than about 120 GPa, and a flexural strength of about 200 MPa or more.</p> |
