| 摘要 |
Described are an underfill material flow control for reducing a space between dies in a semiconductor package and a consequent semiconductor package. According to the embodiment of the present invention, a semiconductor device includes first and second semiconductor dies which include each surface with an integrated circuit which is combined with the contact pad of the uppermost metallization layer of a common semiconductor package substrate by a plurality of conductive contacts. The first semiconductor die is separated from the second semiconductor die with a preset space. A barrier structure is arranged between the first semiconductor die and the common semiconductor package substrate and is partially located under the first semiconductor die. An underfill material is in contact with the second semiconductor die and the barrier structure and is not in contact with the first semiconductor die. |
