Semiconductor device and fabrication method therefor

摘要

A semiconductor device (101) includes a support plate (30), a semiconductor element (10), and a conductive post (40) formed by a columnar conductor having a first end portion (41a) at one end and a second end portion (42a) at the other end. The support plate (30) has a plurality of holes (30b) formed therein, and a conductor (33) formed on a wall surface of the hole (30b). The second end portion (42a) of the conductive post (40) is connected to electrodes (12 to 14) of the semiconductor element (10) via conductive materials (72a to 72c). A side surface of the conductive post (40) is fixed to the wall surface of the hole (30b) deformed by pressing force of the conductive post (40) on a side closer to the first end portion (41a) than the second end portion (42a).