发明名称 INFRARED SENSOR, THERMAL IMAGING CAMERA AND METHOD FOR PRODUCING A MICROSTRUCTURE FROM THERMOELECTRIC SENSOR RODS
摘要 <p>An infrared sensor with a microstructure has a multiplicity of sensor rods protruding from a sensor base and arranged axially parallel to one another. Each of the sensor rods is designed as a thermocouple, in that a first rod end, arranged on the sensor base, is electrically connected to an opposite free second rod end by both a first and a second electrically conductive rod element. The two rod elements have a different Seebeck coefficient, and the first rod element is formed as a hollow profile and the second rod element is arranged in the first rod element such that each thermocouple is formed as a single rod with a small standing area on the sensor base.</p>
申请公布号 EP2820388(A1) 申请公布日期 2015.01.07
申请号 EP20130705134 申请日期 2013.02.11
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 HEDLER, HARRY;KÜHNE, INGO;SCHIEBER, MARKUS;ZAPF, JÖRG
分类号 G01J5/12;G01J5/02;H01L35/32;H01L35/34 主分类号 G01J5/12
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