发明名称 |
INFRARED SENSOR, THERMAL IMAGING CAMERA AND METHOD FOR PRODUCING A MICROSTRUCTURE FROM THERMOELECTRIC SENSOR RODS |
摘要 |
<p>An infrared sensor with a microstructure has a multiplicity of sensor rods protruding from a sensor base and arranged axially parallel to one another. Each of the sensor rods is designed as a thermocouple, in that a first rod end, arranged on the sensor base, is electrically connected to an opposite free second rod end by both a first and a second electrically conductive rod element. The two rod elements have a different Seebeck coefficient, and the first rod element is formed as a hollow profile and the second rod element is arranged in the first rod element such that each thermocouple is formed as a single rod with a small standing area on the sensor base.</p> |
申请公布号 |
EP2820388(A1) |
申请公布日期 |
2015.01.07 |
申请号 |
EP20130705134 |
申请日期 |
2013.02.11 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
HEDLER, HARRY;KÜHNE, INGO;SCHIEBER, MARKUS;ZAPF, JÖRG |
分类号 |
G01J5/12;G01J5/02;H01L35/32;H01L35/34 |
主分类号 |
G01J5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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