| 摘要 |
A package-on-package and a method of fabricating the same capable of increasing mounting density of a semiconductor package are provided. The method includes providing a flexible substrate first, second, and third printed circuit patterns formed on the upper and lower surfaces of the flexible substrate. First and second semiconductor chips and then respectively mounted to substantially central portions of the upper and lower surfaces of the flexible substrate and electrically connected to the first printed circuit patterns. A package body is formed by sealing the first printed circuit pattern and the semiconductor chips. Portions of the flexible substrate having the second and third printed circuit patterns are then bent towards and adhered to the upper and lower surfaces of the package body. |
