发明名称 MOUNTING METHOD USING THERMO-COMPRESSION BONDING HEAD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a mounting method using a thermo-compression bonding head which can mount an electric component on a wiring board in short time and with high connection reliability. <P>SOLUTION: The method is to mount the electric component 20 on the wiring board 10 by using the thermo-compression bonding head 3 having elastic compression members 7 formed of elastomer in a heatable metallic head body 5. The method has a step of arranging adhesive in a mounting region on the wiring board 10, arranging the electric component 20 in the mounting region, and thermo-compression-bonding the electric component 20 onto the wiring board 10 by using the thermo-compression bonding head 3. During thermo-compression bonding, the top region 21 of the electric component 20 is depressed by a metallic part of the head body 5, and adhesive 30 near the side region 22 of the electric component is depressed by tapered sides 7a of the elastic thermo-compression bonding members 7. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008028039(A) 申请公布日期 2008.02.07
申请号 JP20060197275 申请日期 2006.07.19
申请人 SONY CHEMICAL & INFORMATION DEVICE CORP 发明人 FURUTA KAZUTAKA;TANIGUCHI MASAKI
分类号 H01L21/60;H01L21/603;H05K3/32 主分类号 H01L21/60
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