| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide: a wiring board excellent in the electrical characteristics and reliability capable of electrically connecting wiring patterns between layers without a method of forming a via hole and at the same time, of forming wiring patterns in a high density; a method of manufacturing the same; and a semiconductor device. <P>SOLUTION: In the semiconductor device, a semiconductor device 70 is mounted on a wiring board, on which on the surface of a substrate 31, a wiring pattern 40 and a projection part 32 are formed so that the wiring pattern 40 protrudes on a top part 32b of the projection part 32, the surface on which the wiring pattern 40 is formed is coated with an insulating layer 60, and the surface of a connection part 40c of the wiring pattern 40 formed on the top part 32b of the projection part 32 is formed so as to be exposed at the same height of or lower than the surface of the insulating layer 60, wherein the connection part 40c is formed as a pad for connection that is formed by being aligned with a connection electrode of the semiconductor device 70 and the semiconductor device 70 is mounted by being electrically connected with the connection part 40c by a flip-flop connection. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
