发明名称 |
SEMICONDUCTOR LASER CHIP PACKAGE WITH ENCAPSULATED RECESS MOLDED ON SUBSTRATE AND METHOD FOR FORMING SAME |
摘要 |
<p>A laminate leadless carrier package having a semiconductor chip mounted at the edge of a recess region in a substrate supporting the chip, the substrate having a plurality of conductive and dielectric layers, a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate. An encapsulation covers the laser chip, the wire bond, and at least a portion of the top surface of the substrate including the recess region. The encapsulation is an optically transparent molding compound. The package is arranged to be mounted as a side-looker and/or a top-looker.</p> |
申请公布号 |
EP2820726(A2) |
申请公布日期 |
2015.01.07 |
申请号 |
EP20130709016 |
申请日期 |
2013.02.27 |
申请人 |
EXCELITAS CANADA INC. |
发明人 |
JU, JIN, HAN;BURMAN, ROBERT;DELEON, JERRY |
分类号 |
H01S5/02;H01S5/022 |
主分类号 |
H01S5/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|