| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer transfer device of which structure and control is simple and is equipped with a wafer transfer robot, capable of suppressing flying of dust and capable of preventing interferences inside the wafer transfer device. <P>SOLUTION: The minimum turning radius R for a robot arm 41 is set to (B/2<R≤B-L0). As a result, the robot arm 41 is prevented from interfering with a front surface wall 110, allowing longer link for link bodies 41a-41c of the robot arm 41. By limiting the angular displacement operation region of the robot arm to be 360°or smaller, for example, about 180°, the robot arm is prevented from interfering with the rear surface wall as well. By making the link length larger, direct acting mechanism can be eliminated for driving a robot in the lateral direction, to suppress occurrence of dust. Furthermore, by increasing the link length, the number of links required for the robot arm is decreased, for simplified structure of the robot and easy robot control. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
