| 摘要 |
A treating-liquid injection member and a substrate cleaning apparatus having the same are provided to eliminate pollutants attached in a trench and a contact hole in a patterned semiconductor substrate by spraying treating liquid in various angles. A treating-liquid injection member comprises a body part(142), an injection part(144). The body part serves as a passage where the treating liquid flows inside. The injection part sprays the treating liquid received from the body part to a semiconductor substrate, comprising an injection body(144a) which is convex downwards, having a plurality of injection holes(144b) for spraying the treating liquid in various angles toward a surface of the substrate.
|
