| 摘要 |
A vacuum suction apparatus is provided to find whether or not wafers or glass substrates are vacuum-suctioned to an upper surface of the substrate mounting table by including a suction hole, a vacuum sensing hole and a pressure sensor. A vacuum suction apparatus comprises a suction hole(6), a vacuum sensing hole(8) and a pressure sensor(11). The suction hole is formed in a substrate mounting table, and has one opened end in an upper surface of the substrate mounting table and the other end coupled to a pipe connected to a vacuum source. The vacuum sensing hole has one opened end in the upper surface of the substrate mounting table and the other end connected to a sensing pipe(10) equipped with the pressure sensor.
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