| 摘要 |
<p>A tantalum-based sintered body sputtering target produced by mixing a tantalum powder with a titanium powder and sintering the resulting mixture, and characterized in that the content of titanium is 50 wt% or less (wherein 0 wt% is excluded), the remainder is made up by tantalum and unavoidable impurities, the relative density is 90% or more. Provided are: a tantalum-based sintered body sputtering target for use in the formation of a barrier film for preventing the diffusion of a substance in a laminate (film) or a copper diffusion-preventing barrier film on which electroless copper plating can be applied, and a process for producing the sputtering target; and a target in which the density of a Ta-Ti target can be improved by a sintering method, the uniformity of the composition of the target can be improved and the segregation can be reduced.</p> |
