发明名称 研磨材
摘要 PROBLEM TO BE SOLVED: To prevent polishing defects, such as scratches and undulations, on a transparent conductive film. SOLUTION: A polishing agent is composed of fine particles of a functional group-containing organic polymer compound capable of hydrolyzing a transparent conductive film made of ITO, FTO, or the like. As a functional group, a cationic group, such as an amino group, and an anionic group, such as a carboxyl group, may be adopted. As an organic polymer compound, polyacrylic acid ester, polyacrylamide, polystyrene, and the like are suitable. The polishing agent is dispersed in a dispersion medium including at least water, and is used for chemical mechanical polishing, by means of a loose grain method, on a transparent conductive film. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5648153(B2) 申请公布日期 2015.01.07
申请号 JP20100204842 申请日期 2010.09.13
申请人 发明人
分类号 B24B37/00;C09K3/14;H01L21/304 主分类号 B24B37/00
代理机构 代理人
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