| 摘要 |
<p>The present invention relates to a wiring substrate. A wiring substrate (A) includes: an insulating layer (3) including a lower layer conductor (5) on the lower surface thereof; a plurality of semiconductor element connection pads (10) arranged in a lattice pattern in a semiconductor element mounting part (1a) having a quadrangular shape on the insulating layer (3); a via hole (7a) formed in the insulating layer (3) below each of the semiconductor element connection pads (10) with the lower layer conductor (5) as a bottom surface; and a via conductor (9a) filled in the via hole (7a) and formed integrally with each of the semiconductor element connection pads (10). The wiring substrate (A) includes: a reinforcing via hole (7b) formed in the insulating layer (3) in an outer region outside an arrangement region (1b) of the semiconductor element connection pads (10) in corners of the semiconductor element mounting part (1a) with the lower layer conductor (5) as a bottom surface; and a reinforcing via conductor (9b) formed in the reinforcing via hole (7b).</p> |
