| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a small, thin wiring board which can secure the reliability of a buried component and the reliability of connection with a conductive layer including the component, a component connection and a wiring line and which also can secure an adhesion between the conductive layer and an insulating layer and can attain high-density wiring, and also a method of manufacturing the wiring board. <P>SOLUTION: Wiring patterns 201, 202 and component connections 203a, 203b, 204a, 204b made of conductors such as copper foils are formed on both surfaces of a planar base material 200 made of an electrically insulating material and having a constant thickness. The upper and lower surfaces of the base material 200 other than component mounting openings 209, 210 including the component connections 203a, 203b, 204a, 204b and the upper surface of the wiring patterns 201, 202 are covered with protective layers 207, 208. The protective layers 207, 208 are laminated on the base material 200, and a resistance element 213 and a chip capacitor 214 are buried therein and sealed. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
