发明名称 Multilayer dielectric tunnel barrier used in magnetic tunnel junction devices, and its method of fabrication
摘要 A multilayer dielectric tunnel barrier structure and a method for its formation which may be used in non-volatile magnetic memory elements comprises an ALD deposited first nitride junction layer formed from one or more nitride monolayers i.e., AlN, an ALD deposited intermediate oxide junction layer formed from one or more oxide monolayers i.e., Al<SUB>x</SUB>O<SUB>y</SUB>, disposed on the first nitride junction layer, and an ALD deposited second nitride junction layer formed from one or more nitride monolayers i.e., AlN, disposed on top of the intermediate oxide junction layer. The multilayer tunnel barrier structure is formed by using atomic layer deposition techniques to provide improved tunneling characteristics while also providing anatomically smooth barrier interfaces.
申请公布号 US7402833(B2) 申请公布日期 2008.07.22
申请号 US20050106509 申请日期 2005.04.15
申请人 MICRON TECHNOLOGY, INC. 发明人 DREWES JOEL A.
分类号 H01L29/06;C23C16/30;C23C16/40;C23C16/44;C23C16/455;H01F10/32;H01F41/22;H01F41/32;H01L21/316;H01L29/08;H01L39/00;H01L43/12 主分类号 H01L29/06
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