发明名称 |
CONDUCTIVE LINE PATTERNING |
摘要 |
The present invention relates to conductive line patterning. The method includes placing two conductive lines in a layout. Two cut lines are placed over at least a part of the two conductive lines in the layout. The cut lines designate cut sections of the two conductive lines and the cut lines are spaced from each other within a fabrication process limit. The two cut lines are connected in the layout. The two conductive lines are patterned over a substrate in a physical integrated circuit using the two connected parallel cut lines. The two conductive lines are electrically conductive. |
申请公布号 |
KR20150002499(A) |
申请公布日期 |
2015.01.07 |
申请号 |
KR20140078060 |
申请日期 |
2014.06.25 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LIU RU GUN;HSIEH TUNG HENG;TSAI TSUNG CHIEH;WU JUING YI;LEE LIANG YAO;TING JYH KANG |
分类号 |
H01L21/027;H01L21/60 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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