| 摘要 |
<p>The present invention provides a wafer bonder capable of stably aligning a wafer. The wafer bonder according to one aspect of the present invention includes a first stage on which the wafer is mounted, a second stage which faces the first stage, a first holder which supports the wafer, is installed to vertically move, and includes a support protrusion, and a second holder which is located on the upper side of the first holder and includes a support protrusion which supports the wafer to be closely attached to the second stage.</p> |
