| 摘要 |
<p>The present invention relates to a plasma cleaning apparatus for cleaning a semiconductor package through a plasma discharge during a process of manufacturing a semiconductor. A plasma cleaning apparatus for manufacturing a semiconductor package according to the present invention includes: a main body (100) provided with a cleaning chamber (110) for plasma cleaning; a lead frame supply unit (200) for supplying a lead frame (L) to be cleaned to the main body; a carrier (300) including upper and lower frames (310, 320) and a clamper (330) for separably coupling the upper and lower frames to each other in order to allow the upper and lower frames to support the lead frames supplied through the lead frame supply unit in a horizontal state; a carrier stage (400) on which the carrier is placed and the clamping and releasing of the clamper are performed; a carrier loader (500) for picking up the carrier in a clamping state of the horizontally supported lead frames placed on the carrier stage to carrying the carrier to the inside of a cleaning chamber; a carrier unloader for picking up the carrier in the cleaning chamber to carry the carrier to the carrier stage after the cleaning is completed; and a lead frame output unit (700) for discharging the lead frame in the carrier transferred to the carrier stage through the carrier unloader to the outside of the main body.</p> |
