| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat conductive substrate exhibiting excellent heat conduction characteristics, ensuring a practical bonding strength of a metal layer and an insulation layer without providing an adhesive layer, and further exhibiting excellent heat resistance, and to provide a heat conductive polyimide film. SOLUTION: The heat conductive substrate has a metal layer on one or both surfaces of an insulation layer having at least one filler-containing polyimide resin layer where a heat conductive filler is dispersed into the polyimide resin. The filler-containing polyimide resin layer has the content of heat conductive filler in the range of 5-80wt%. The polyimide resin in the filler-containing polyimide resin layer has such a structure as polyimide siloxane is crosslinked by an amino compound, because the amino group of the amino compound having at least two primary amino groups as functional groups reacts on a ketone group in polyimide siloxane having a specific structural unit. COPYRIGHT: (C)2013,JPO&INPIT |
