METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER ADHERING LAMINATE AND METHOD FOR PUTTING THE LAMINATE ON THE SEMICONDUCTOR WAFER

摘要

An adhesive sheet is provided with a peeling base material (10), a base material film (14), and a first adhesive layer (12) arranged between the peeling base material (10) and the base material film (14). On the peeling base material (10), an annular cut part (D) is formed from a plane on the side of the first adhesive layer (12). The first adhesive layer (12) is stacked to cover the entire plane on the inner side of the cut part (D) on the peeling base material (10). The cut depth (d) of the cut part (D) is less than the thickness of the peeling base material (10) and is 25mum or less.