| 摘要 |
<P>PROBLEM TO BE SOLVED: To adjust a component mounting position to an effective solder printing position on a land for soldering, even when the opening of a resist pattern for covering the surface of a circuit substrate is displaced to the position of the land for soldering. <P>SOLUTION: In a system, the positions of a substrate mark 18 and a resist mark 19 are recognized based on the photographing image of a camera to sense respectively first and second coordinate systems for representing the forming positions of a land 12 and a resist pattern 13 and to operate the displacement between both coordinate systems. Further, the first coordinate system (or the second coordinate system) is corrected by the correcting quantity corresponding to the predetermined rate (e.g., 1/2) of the displacement between the coordinate systems to set a third coordinate system in an intermediate position between the first and second coordinate systems. Moreover, the position for printing a solder 20 and the position for mounting a component 16 are determined in the land 12 by using the third coordinate system to perform solder printing and the component mounting. <P>COPYRIGHT: (C)2009,JPO&INPIT |
