发明名称 LIGHT EMITTING DIODE HAVING METAL PATTERN AND METHOD FOR MANUFACTURING THE SAME
摘要 A light emitting diode including the metal pattern and a manufacturing method thereof are provided to omit the wire bonding process by electrically connecting the light emitting diode and lead frame. A light emitting diode comprises a substrate(100), a lead frame(200), a light emitting diode(300), a supporting part(400), a metal pattern(500) and a mold film(600). A lead frame is arranged on the substrate of the light emitting diode. The light emitting diode is located on the lead frame. The mold film having the metal pattern in order to electrically connect the light emitting diode and the lead frame is arranged on the substrate. The light emitting diode is located on a first lead terminal(210). In case a second lead terminal(220) is extended to the center of the substrate, the light emitting diode is located on a second lead terminal.
申请公布号 KR20090002179(A) 申请公布日期 2009.01.09
申请号 KR20070060710 申请日期 2007.06.20
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 PARK, BYOUNG YOUL;KIM, WON IL
分类号 H01L33/00D07 主分类号 H01L33/00D07
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