A VISION INSPECTION AND MARKING SYSTEM OF THE SEMICONDUCTOR PACKAGE

摘要

The present invention relates to a vision inspection and marking system for a semiconductor package having improved accuracy in vision inspection and marking as deflection of the semiconductor package adsorbed onto an adsorption fixing means by a rubber pad installed on an adsorption plate is automatically corrected. The vision inspection and marking system for a semiconductor package according to the present invention comprises: a circulating device; a moving and arranging supply device; a substrate adsorption moving device composed of an adsorption fixing means; a moving picker unit; a vision reading information on a semiconductor package which is installed in the moving picker unit and is moved and arranged; a marking device composed of a first making unit and a second marking unit; and a cleaning device removing foreign substances from the semiconductor package.