发明名称 Heat pipe embedded heat sink with integrated posts
摘要 A heat sink 20 has supporting mounting post 24A,B monolithically formed with the heat sink 20 to a first side. A printed wiring board 40 may be attached to a second, top, side of the heat sink; the PCB carrying electronic components 42A,B. One or more (see figure 1) heat pipes 30 are attached to the first, bottom, side of the heat sink with a first end 32A near the component 42A and second end 34A near a post 24A. Figure 1 shows a plan view showing a possible routing of the heat-pipes.
申请公布号 GB2515880(A) 申请公布日期 2015.01.07
申请号 GB20140007700 申请日期 2014.05.01
申请人 HAMILTON SUNDSTRAND CORPORATION 发明人 JAY W KOKAS;KENNETH TROTMAN;KERRY R QUERNS;RACHEL FARNER
分类号 H05K1/02;F28D15/02;H01L23/427;H05K1/05 主分类号 H05K1/02
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