摘要 |
A heat sink 20 has supporting mounting post 24A,B monolithically formed with the heat sink 20 to a first side. A printed wiring board 40 may be attached to a second, top, side of the heat sink; the PCB carrying electronic components 42A,B. One or more (see figure 1) heat pipes 30 are attached to the first, bottom, side of the heat sink with a first end 32A near the component 42A and second end 34A near a post 24A. Figure 1 shows a plan view showing a possible routing of the heat-pipes. |