Semiconductor device and method for manufacturing the same

摘要

In an SOP1 having a semiconductor chip (11) and another semiconductor chip(21), in wire (6,7) coupling between the chips (11, 21), a withstand voltage can be secured by setting an inter-wire distance between a wire in a first wire group (6) that is closest to a second wire group (7) and a wire in the second wire group that is closest to the first wire group to be larger than an inter-wire distance between any wires in the first wire group (6) and the second wire group (7), which makes it possible to attain improvement of reliability of the SOP1.