| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of obtaining high integration. <P>SOLUTION: A semiconductor 1 comprises: a substrate 10: a semiconductor chip 20 fixed on the substrate 10; sealing resin 24 for sealing the semiconductor chip 20; and a heatsink 30 disposed so as to cover the semiconductor chip 20, wherein the heatsink 30 has a conductive plate 32 which comprises a wire wound in a spiral shape from the center of the conductive plate 32 to the outside on the same level, and works as an inductor element. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
