发明名称 |
LASER PROCESSING METHOD AND SEMICONDUCTOR DEVICE |
摘要 |
<p>A laser processing method which can reliably form a modified region within an object to be processed along a desirable part in a line to cut is provided. This laser processing method irradiates a substrate 4 with laser light L while locating a light-converging point P within the substrate 4, so as to form a quality modified region 71 to become a starting point region for cutting within the substrate 4 along a line to cut 5. Here, the laser light L is oscillated pulsewise along a desirable part RP in the line to cut 5, and continuously in a predetermined part RC in the line to cut 5. Consequently, the quality modified region 71 is formed within the substrate 4 along the desirable part RP in the line to cut 5, whereas no quality modified region 71 is formed within the substrate 4 along the predetermined part RC in the line to cut 5.</p> |
申请公布号 |
EP1775059(B1) |
申请公布日期 |
2015.01.07 |
申请号 |
EP20050767042 |
申请日期 |
2005.07.27 |
申请人 |
HAMAMATSU PHOTONICS K.K. |
发明人 |
KUNO, KOJI;SUZUKI, TATSUYA;SAKAMOTO, TAKESHI |
分类号 |
B23K26/40;B23K26/06;B23K101/40;B28D5/00;C03B33/09;H01L21/301 |
主分类号 |
B23K26/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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