| 发明名称 |
THICK FILM PHOTORESISTS AND METHODS FOR USE THEREOF |
| 摘要 |
New methods and compositions are provided that enable application and processing of photoresist as thick coating layers, e.g. at dried layer (post soft-bake) thicknesses of in excess of 2 microns. Resists can be imaged at short wavelengths in accordance with the invention, including 248 nm.
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| 申请公布号 |
KR20090036153(A) |
申请公布日期 |
2009.04.13 |
| 申请号 |
KR20097006655 |
申请日期 |
2009.03.31 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. |
发明人 |
THACKERAY JAMES W.;MORI JAMES M.;TENG GARY GANGHUI |
| 分类号 |
G03F7/004;G03F7/039;G03F7/16;G03F7/26;G03F7/38;H01L21/027 |
主分类号 |
G03F7/004 |
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