发明名称 WIRE ARRANGEMENT FOR AN ELECTRONIC CIRCUIT AND METHOD OF MANUFACTURING THE SAME
摘要 <p>The present invention relates to an electronic circuit arrangement (10) comprising: a substrate (12) having a first surface (12a) and a second surface (12b), an electronic circuit, an electrical connection part (16) for providing an electrical connection to the electronic circuit and being arranged on the first surface (12a), and at least one electrical wire (18). The electrical wire (18) comprises at least one conductive core (20) and an isolation (22) surrounding the conductive core (20). An end portion (18a) of the electrical wire (18) is an isolation-free portion for allowing access to the conductive core (20), wherein the end portion (18a) of the electrical wire (18) is connected to the electrical connection part (16). At least one through-hole (24) extending from the first surface (12a) to the second surface (12b) is provided in the substrate (12), wherein the electrical wire (18) is arranged through the through-hole (24).</p>
申请公布号 EP2820672(A2) 申请公布日期 2015.01.07
申请号 EP20130716403 申请日期 2013.02.20
申请人 KONINKLIJKE PHILIPS N.V. 发明人 DEKKER, RONALD;HENNEKEN, VINCENT ADRIANUS;MULDER, MARCEL
分类号 H01L23/48;A61B1/00;A61B1/05;H01L21/768;H01L23/485;H01L23/49;H01L29/06 主分类号 H01L23/48
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