LED DEVICE PACKAGE AND THE METHOD FOR FABRICATING OF THE SAME

摘要

The present invention relates to an LED device package and a method for manufacturing the same. The LED device package includes: a light emitting device on which a first semiconductor layer, an active layer, a second semiconductor layer, and a transparent electrode are formed; a first electrode pad which is formed on the transparent electrode of the light emitting device; a metal ball which is formed on the first electrode pad and the second electrode pad; a contact layer which includes a structure which a nano metal particle is attached to a liposomes binder to be inserted between either the first or second electrode pad and the metal ball; and a printed circuit board which the light emitting device is disposed on. The method for manufacturing the LED device package includes the steps of: arranging the light emitting device; forming the first electrode pad on the transparent electrode of the light emitting device and the second electrode pad on the first semiconductor layer; forming a contact layer including the structure which the nano metal particle is attached to the liposomes binder on the first or second electrode pad; and forming the metal ball on the contact layer. The present invention prevents a defect of crack in a process of binding the electrode pad and the metal ball.