熱硬化性樹脂組成物、その硬化物、活性エステル樹脂、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition achieving excellent heat resistance and flame retardancy in a cured product of the composition while having a low dielectric constant and a low dielectric loss tangent, and to provide a cured product of the composition, an active ester resin that develops the above performances, and a semiconductor sealing material, a prepreg, a circuit board and a build-up film obtained from the composition.SOLUTION: The resin composition comprises, as essential components: an active ester resin (A) having a polyaryleneoxy structure as a main skeleton and an arylcarbonyloxy group included in an aromatic nucleus of the structure; and an epoxy resin (B).