| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with a connector having a highly reliable structure, and to provide a manufacturing method therefor. SOLUTION: In the semiconductor device 1 with a connector, a semiconductor module housing section 111 for housing a semiconductor module 10 is integrated with a connector 110 housing an external connection terminal 105 for external connection. The semiconductor device 1 with a connector comprises a semiconductor module fixing means 12 in which a semiconductor module fixing portion 121 for fixing the semiconductor module 10 while holding the inside of the external connection terminal 105 by using a thermoplastic resin TPR, and a fixing means fixed portion 122 for holding the semiconductor module fixing means 12 at a predetermined position in a mold 2 when forming the connector 110 are formed. COPYRIGHT: (C)2012,JPO&INPIT |
