| 摘要 |
<p>The invention relates to devices for vacuum evaporation of metals and alloys. It may be used, for example, for depositing comparatively thick coatings onto roll substrates and disperse materials in lengthy processes, as well as for producing free metal foils. It is necessary to evaporate considerable amount of the material in order to implement highly productive processes and deposit thick coatings in vacuum. Usually the deposited material feeding into the evaporator during the deposition process is used in order to evaporate so big amount of the material. Evaporation instability and significant variation of the coating thickness are observed under such operation conditions. Process instability increases in evaporating some metals (for example, tin, silver). In accordance with the offered invention the evaporator is provided with the chamber of the evaporation fluctuation damping. It allows expending the range of evaporation rates while using various metals and substrates. If different vapour sources, for example, a thermal copper evaporator and magnetron sputtering device, or thermal evaporators of different evaporation rates are used in one technological process, the offered technical solution allows better co-ordination of deposition rates from the mentioned sources. It also provides the possibility to change the evaporation rate in a wide range and select optimal deposition parameters for each deposited layer and upgrade quality of the final product in this way.</p> |
