Semiconductor packages and display devices including semiconductor packages

摘要

Semiconductor packages are provided. A semiconductor package may include a semiconductor chip. The semiconductor package may include a substrate and first and second conductive regions on the substrate. In some embodiments, the substrate may be a flexible substrate, and the first and second conductive regions may be on the same surface of the flexible substrate. Display devices including semiconductor packages are also provided. In some embodiments, a display device may include a flexible substrate that is bent such that first and second conductive regions thereof are connected to each other via an intervening third conductive region.

主权项

1. A chip-on-film package, comprising:
a film substrate comprising first and second surfaces on opposite sides, respectively, thereof; a semiconductor chip mounted on the first surface of the film substrate; a first wire on the second surface of the film substrate and adjacent an end portion of the film substrate; a second wire on the second surface of the film substrate, the second wire being spaced apart from the first wire along the second surface of the film substrate by a separation region positioned therebetween and being electrically connected to the semiconductor chip; and an anisotropic conductive film provided on a portion of the first wire and/or a portion of the second wire, the portion of the first wire and/or the portion of the second wire being positioned adjacent the separation region, wherein the film substrate comprises a folded shape that is folded at the separation region, and wherein the respective portions of the first and second wires are connected to each other via the anisotropic conductive film.