发明名称 |
CONDUCTIVE SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive substrate excellent in conductivity and adhesion.SOLUTION: A conductive substrate is a laminate where an insulation resin layer and a porosity copper layer are arranged in this order on one face side of a substrate. The porosity copper layer includes an insulation resin layer derived component containing region on at least a part of the porosity copper layer. The maximum thickness of the insulation resin layer derived component containing region is larger than 100 nm.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016105449(A) |
申请公布日期 |
2016.06.09 |
申请号 |
JP20140243463 |
申请日期 |
2014.12.01 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
YOSHI NAONOBU;OYAMA KEISUKE |
分类号 |
H05K1/09;B32B5/18;B32B7/02;B32B15/08;H05K3/18 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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