发明名称 CONDUCTIVE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a conductive substrate excellent in conductivity and adhesion.SOLUTION: A conductive substrate is a laminate where an insulation resin layer and a porosity copper layer are arranged in this order on one face side of a substrate. The porosity copper layer includes an insulation resin layer derived component containing region on at least a part of the porosity copper layer. The maximum thickness of the insulation resin layer derived component containing region is larger than 100 nm.SELECTED DRAWING: Figure 1
申请公布号 JP2016105449(A) 申请公布日期 2016.06.09
申请号 JP20140243463 申请日期 2014.12.01
申请人 DAINIPPON PRINTING CO LTD 发明人 YOSHI NAONOBU;OYAMA KEISUKE
分类号 H05K1/09;B32B5/18;B32B7/02;B32B15/08;H05K3/18 主分类号 H05K1/09
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